At CES 2025, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global leader in power systems and IoT semiconductors, joined forces with Flex (NAS...

Micron recently announced the construction of a new advanced packaging facility for high-bandwidth memory (HBM) near its existing operations in Singap...

According to reports from Fast Technology, Samsung's DS division recently completed the logic chip design for its HBM4 memory. The Foundry division ha...

Bourns, a globally recognized leader in electronic components manufacturing, has expanded its product portfolio with the launch of the AEC-Q200-compli...

Apple's A-series smartphone processors have evolved from the A7 (28nm) to the A18 Pro (3nm), featuring more cores, transistors, and functionalities. A...

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