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2025-01-20At CES 2025, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global leader in power systems and IoT semiconductors, joined forces with Flex (NAS...![[{1 1}]](/upfile/news/small_2025011613564019641.png)
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2025-01-16Micron recently announced the construction of a new advanced packaging facility for high-bandwidth memory (HBM) near its existing operations in Singap...![[{1 1}]](/upfile/news/small_2025011313570298171.png)
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2025-01-13According to reports from Fast Technology, Samsung's DS division recently completed the logic chip design for its HBM4 memory. The Foundry division ha...![[{1 1}]](/upfile/news/small_2025010911132270431.png)
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2025-01-09Bourns, a globally recognized leader in electronic components manufacturing, has expanded its product portfolio with the launch of the AEC-Q200-compli...![[{1 1}]](/upfile/news/small_2025010611582843921.png)
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2025-01-06Apple's A-series smartphone processors have evolved from the A7 (28nm) to the A18 Pro (3nm), featuring more cores, transistors, and functionalities. A...![[{1 1}]](/upfile/news/small_2025010210315383451.png)
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2025-01-02Global tech giants like NVIDIA and TSMC are advancing their technologies to maintain leadership in the artificial intelligence (AI) industry. Meanwhil...![[{1 1}]](/upfile/news/small_2024123011263958101.png)
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2024-12-30Market reports suggest that Apple is likely to be among the first customers for TSMC’s 2nm process technology. However, due to cost considerations, t...![[{1 1}]](/upfile/news/small_2024122611261630421.png)
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2024-12-26On December 20 (local time), the U.S. Department of Commerce announced that it would provide Samsung Electronics with up to $4.745 billion (approximat...![[{1 1}]](/upfile/news/small_2024122311215577311.png)
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2024-12-23KAGA FEI, a global developer of short-range wireless solutions, recently introduced an ultra-compact Bluetooth® 6.0 module with a built-in PCB antenn...![[{1 1}]](/upfile/news/small_2024122010092302181.png)
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2024-12-20TDK Corporation has announced the launch of five new SMD multilayer varistors (MLVs). As an industry-first innovation, these components are designed t...![[{1 1}]](/upfile/news/small_2024121611324864301.png)
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2024-12-16NXP and United Microelectronics Corporation (UMC) recently announced the groundbreaking ceremony for their joint venture, VSMC, to build a 300mm wafer...![[{1 1}]](/upfile/news/small_2024121313462689561.png)
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2024-12-13Teledyne e2v has announced the release of engineering samples for the LX2160-Space, a 16-core System-on-Chip (SoC) processor based on the Arm® Cortex...