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BSM75GP60 Advantages and Disadvantages

Advantages:

 - Handles up to 75A continuous and 150A peak, ideal for heavy loads.

 - Suitable for medium-voltage applications like motor drives and UPS systems.

 - Reduces conduction losses, improving overall system efficiency.

 - Enhances performance in high-frequency applications.

 - Protects against reverse voltage in inductive circuits.

 - Equipped with effective heat dissipation (0.4 K/W RthJC).

 - Built to withstand harsh industrial environments and electrical stress.

 - Easy to integrate into existing systems and designs.

Disadvantages:

 - Not suitable for high-voltage applications beyond this threshold.

 - May need additional mechanical work during assembly.

 - While efficient, newer modules may offer even lower switching losses.

 - Alternatives like the BSM75GB60DLC offer faster switching and better thermal resistance.

 - Needs proper driver circuitry to manage gate signals safely.

BSM75GP60 Circuit Diagram

The circuit diagram shown is for the BSM75GP60, a 3-phase IGBT power module commonly used in industrial motor drives and power conversion applications. This module integrates several main power components within a single package to simplify high-power design.

On the left side of the diagram, pins 1, 2, and 3 represent the AC input lines (U, V, W), which are connected to a three-phase full-wave diode bridge rectifier. This section converts AC power into DC by directing current through six diodes arranged in a bridge configuration. The output of the rectifier is presented at pins 21 (positive DC) and 23 (negative DC), while pin 22 is the intermediate DC bus. The center part of the diagram illustrates three half-bridge IGBT inverter legs. Each leg contains an IGBT switch with an anti-parallel diode. These are connected as follows:

- IGBTs 13–14 and 20–19 form the upper and lower switches of phase U (output at pin 7).

- IGBTs 12–11 and 18–17 form phase V (output at pin 4).

- IGBTs 15–6 and 16–5 form phase W (output at pin 5).

Each pair allows controlled switching of the DC power to create three-phase AC output for motor control or inverter applications. Pins 8 and 9 are connected to an NTC thermistor, which provides temperature sensing for thermal protection and monitoring. This helps in maintaining safe operation of the module under varying load and thermal conditions.

BSM75GP60 Packaging Outline

The packaging outline for the BSM75GP60 IGBT module provides the physical and mechanical specifications required for proper mounting and integration into a power electronics system. The outline shows a compact, rectangular housing with precise pin spacing and dimensions, ensuring compatibility with standard heatsinks and PCBs.

The module measures approximately 122 mm in length, 62 mm in width, and 20.5 mm in height, making it suitable for medium- to high-power applications where space efficiency is requisite. The diagram highlights pin layout details, with pin groups clearly arranged and labeled to match the internal circuit configuration. Each pin’s position and spacing are basic for accurate soldering and electrical connectivity.

Mounting holes at the corners, each with a diameter of 5.5 mm, are provided for securely fastening the module to a heatsink or baseplate. These ensure good thermal contact and mechanical stability. The side view indicates a flat baseplate surface for efficient heat transfer, with the height and pin offset designed to align easily with standard mounting hardware.

BSM75GP60 Manufacturer

Eupec was a company specializing in high-power semiconductor solutions, including advanced IGBT modules, thyristors, and diodes for industrial and power electronics applications. Founded in 1990 as eupec GmbH in Warstein, Germany, it became a wholly owned subsidiary of Siemens in 1995. In 1999, Siemens spun off its semiconductor operations, including eupec, into the newly formed Infineon Technologies. Eupec's products have been requisite in industries such as renewable energy, industrial automation, transportation, and power conversion. Today, its legacy continues under Infineon, contributing to a broad portfolio of semiconductor technologies.

Conclusion

Exploring the BSM75GP60 IGBT module shows it's a major player in power electronics, perfect for driving motors and managing power in systems. Its strong performance and reliability make it a top choice for those needing robust electronics. The BSM75GP60 is ideal for upgrading old systems or building new ones, offering top-quality performance and efficiency.

Datasheet PDF

BSM75GP60 Datasheets: